Telcordia (Bellcore) GR-468-CORE
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Reliability Assurance Requirement for Optoelectronic Devices
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Component level qual (Laser diode, LED, PD, …)
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Mechanical, environment and electrical
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Tests in parallel
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Integrity tests – harsh test conditions
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Long duration
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Sampling Plan
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Optical electrical functional testing
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Pass/Fail criteria
The GR-468 test qualification includes:
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1.1
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Scope and Purpose . . . . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . .
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1–1
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1.2
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Reliability Assurance – Overview and Philosophy . . . . . . .
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. . . . . . . . .
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1–2
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1.2.1
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Overview of Reliability Assurance . . . . . . . . . . . . .
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. . . . . . . . .
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1–2
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1.2.2
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Reliability Assurance Generic Requirements Philosophy
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. . . . . . . . .
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1–3
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1.3
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Document History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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1–4
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1.3.1
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Changes Between Issues 1 and 2 of GR-468-CORE . . . . . . . . . . . . .
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1–4
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1.3.2
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Changes Between TR-NWT-000468/TA-NWT-000983 and GR-468-CORE,
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Issue 1 . . . . . . . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . .
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1–5
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1.4
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Related Telcordia Documents . . . . . . . . . . . . . . . . . .
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. . . . . . . . .
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1–6
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1.5
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Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . .
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1–7
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1.5.1
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Device Terminology . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . .
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1–7
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1.5.2
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Suppliers, Manufacturers, and Customers . . . . . . . .
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. . . . . . . . . 1–11
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1.5.3
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Operating Environments . . . . . . . . . . . . . . . . . .
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. . . . . . . . . 1–11
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1.5.3.1
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CO Environment . . . . . . . . . . . . . . . . . . .
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. . . . . . . . . 1–12
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1.5.3.2
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UNC Environment . . . . . . . . . . . . . . . . . .
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. . . . . . . . . 1–12
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1.5.4
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Quality Levels . . . . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . . 1–13
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1.5.5
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Failure Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–15
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1.5.6
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Requirements Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . 1–15
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1.6
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Requirement Labeling Conventions . . . . . . . . . . . . . . . . . . . . . . . . 1–16
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1.6.1
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Numbering of Objects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–16
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1.6.2
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Identification of Object Content . . . . . . . . . . . . . . . . . . . . . . . 1–16
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1.6.3
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Requirement Object Absolute Number Assignment . . . . . . . . . . . . 1–17
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2 Reliability Assurance Processes
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2.1 Supplier Approval and Device Qualification . . . . . . . . . . . . . . . . .
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.
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.
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2–1
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2.1.1
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Specification and Control . . . . . . . . . . . . . . . . . . . . . . . . .
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.
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.
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2–2
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2.1.2
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Supplier Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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.
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.
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2–2
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2.1.3
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Common Process-Related Criteria for Device Qualification . . . . .
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.
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2–3
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2.1.3.1
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Qualification Test Documentation . . . . . . . . . . . . . . . .
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.
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.
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2–3
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2.1.3.2 Qualification of Devices by Similarity . . . . . . . . . . . . . . .
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.
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.
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2–5
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2.1.3.3
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Levels of Assembly for Qualification . . . . . . . . . . . . . . .
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.
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.
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2–5
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2.1.3.4 Provisional Use of Devices . . . . . . . . . . . . . . . . . . . . .
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.
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.
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2–6
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2.1.3.5 Use of Supplier-Provided Data . . . . . . . . . . . . . . . . . . .
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.
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.
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2–8
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2.1.3.6
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Treatment of Internally Manufactured Devices . . . . . . . . .
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.
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.
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2–8
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2.1.3.7
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Sampling for Qualification Tests . . . . . . . . . . . . . . . . .
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.
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.
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2–9
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2.1.3.7.1
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LTPD Sampling Plan . . . . . . . . . . . . . . . . . . . . .
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.
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2–9
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2.1.3.7.2
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Use of Nonconforming Devices for Qualification . . . . .
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. 2–10
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2.1.3.7.3
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Treatment of Low Volume Parts . . . . . . . . . . . . . .
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. 2–11
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2.1.3.7.4
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Characterization Test Data for Additional Samples . . . .
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. 2–11
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2.1.3.7.5
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Additional Considerations for Stress Tests . . . . . . . .
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. 2–11
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2.1.3.8
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Device Codes that Fail Qualification . . . . . . . . . . . . . . .
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. 2–12
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2.1.4
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Requalification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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. 2–13
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2.2
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Lot-to-Lot Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–15
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2.2.1
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Definition of a Lot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–15
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2.2.2
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Purchase Specifications
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. . . . . . . . . . . . . . . . . . . . . . . . . . . 2–16
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2.2.3
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Sampling for Lot-to-Lot Controls . . . . . . . . . . . . . . . . . . . . . . . 2–16
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2.2.3.1
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AQL-Based Sampling
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. . . . . . . . . . . . . . . . . . . . . . . . . . 2–17
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2.2.3.2 Treatment of Low Volume Parts . . . . . . . . . . . . . . . . . . . . 2–17
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2.2.4
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Source Inspection/Incoming Inspection . . . . . . . . . . . . . . . . . . . 2–18
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2.2.4.1 Use of Supplier-Provided Data . . . . . . . . . . . . . . . . . . . . . 2–18
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2.2.4.2
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Treatment of Internally Manufactured Devices . . . . . . . . . . . 2–19
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2.2.4.3
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Controls for Devices Used in Purchased Modules . . . . . . . . . . 2–19
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2.2.5
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Lot-to-Lot Control Documentation . . . . . . . . . . . . . . . . . . . . . . 2–19
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2.2.6
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Lot-to-Lot Control Test Areas
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. . . . . . . . . . . . . . . . . . . . . . . . 2–20
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2.2.6.1
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Visual Inspection
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–20
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2.2.6.2
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Electrical and Optical Testing
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. . . . . . . . . . . . . . . . . . . . . 2–21
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2.2.6.3
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Screening . . . .
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–21
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2.2.7
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Data Recording and Retention . . . . . . . . . . . . . . . . . . . . . . . . 2–22
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2.2.8
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Summary of Supplier History Data
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. . . . . . . . . . . . . . . . . . . . . 2–23
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2.2.9
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Treatment of Defective Devices and Lots . . . . . . . . . . . . . . . . . . 2–23
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2.2.10
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Ship-to-Stock Programs . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–23
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2.3 Feedback and Corrective Action . . . . . . . . . . . . . . . . . . . . . . . . . . 2–25
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2.3.1
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Lot-to-Lot Control Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–26
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2.3.2
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Circuit Pack Test and Burn-In
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. . . . . . . . . . . . . . . . . . . . . . . . 2–26
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2.3.3
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System-Level Test and Burn-In . . . . . . . . . . . . . . . . . . . . . . . . 2–27
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2.3.4
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Repair of Field Returns . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–27
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2.3.5
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Unconfirmed Circuit Pack Failures
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. . . . . . . . . . . . . . . . . . . . . 2–27
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2.3.6
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Data Collection and Analysis . . . . . . . . . . . . . . . . . . . . . . . . . 2–28
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2.3.7
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Device Failure Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–28
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2.4 Device Storage and Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–29
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2.4.1
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Nonconforming Material . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–29
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2.4.2
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Material Review System
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. . . . . . . . . . . . . . . . . . . . . . . . . . . 2–29
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2.4.3
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Stockroom Inventory Practices
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. . . . . . . . . . . . . . . . . . . . . . . 2–29
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2.4.3.1
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FIFO Inventory Policy
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. . . . . . . . . . . . . . . . . . . . . . . . . 2–29
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2.4.3.2 Reworked Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–30
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2.4.4
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ESD Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–30
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2.5
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Documentation and Test Data
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. . . . . . . . . . . . . . . . . . . . . . . . . . . 2–31
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2.5.1
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Availability of Documentation
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. . . . . . . . . . . . . . . . . . . . . . . . 2–32
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2.5.2
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Availability of Other Information
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. . . . . . . . . . . . . . . . . . . . . . 2–32
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2.6 Availability of Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–33
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2.7
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Environmental, Health, Safety, and Physical Design Considerations . . . . . . 2–33
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2.7.1
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Environmental Considerations . . . . . . . . . . . . . . . . . . . . . . . . 2–33
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2.7.2
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Health Considerations
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–33
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2.7.3
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Safety Considerations – Flammability . . . . . . . . . . . . . . . . . . . . 2–34
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2.7.4
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Physical Design Considerations
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. . . . . . . . . . . . . . . . . . . . . . . 2–34
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2.7.4.1
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Hermeticity . . . . . . . .
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. . . . . . . . . . . . . . . . . . . . . . . 2–34
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2.7.4.2
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Solder Flux . . . . . . . .
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. . . . . . . . . . . . . . . . . . . . . . . 2–35
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2.7.4.3
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Allowable Terminal and Lead Finishes . . . . . . . . . . . . . . . . 2–35
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3 Test Procedures
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3.1
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General Test Procedure Criteria . . . . . . . . . . . . . . . . . . . . . . . . . .
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3–1
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3.1.1
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Standardized Test Procedures . . . . . . . . . . . . . . . . . . . . . . . .
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3–1
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3.1.2
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Test Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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3–2
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3.1.3
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Establishment of Pass/Fail Criteria . . . . . . . . . . . . . . . . . . . . .
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3–2
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3.1.4
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Alternative Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . .
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3–2
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3.1.4.1 Calculation of Equivalent Test Conditions . . . . . . . . . . . . . .
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3–3
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3.1.4.2 Activation Energies . . . . . . . . . . . . . . . . . . . . . . . . . . .
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3–4
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3.1.4.3 Additional Considerations Related to Multiple Failure
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Mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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3–5
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3.2
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Characterization Test Procedures . . . . . . . . . . . . . . . . . . . . . . . . .
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3–6
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3.2.1
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Spectral Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .
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3–6
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3.2.1.1 Spectral Characteristics for MLM Lasers . . . . . . . . . . . . . . .
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3–7
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3.2.1.2 Spectral Characteristics for SLM Lasers . . . . . . . . . . . . . . .
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3–9
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3.2.1.2.1 Considerations for Continuous Wave Lasers . . . . . . . . . . 3–10
3.2.1.2.2 Considerations for WDM Lasers . . . . . . . . . . . . . . . . . 3–11
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3.2.1.2.3
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Considerations for Tunable Lasers . . . . . . .
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. . .
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. . .
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.
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. 3–12
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3.2.1.2.4
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Considerations for High Bit-Rate Applications
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. . .
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. . .
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.
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. 3–12
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3.2.1.3 Spectral Characteristics for LEDs . . . . . . . . . . . . . . . . . . . 3–13
3.2.2 Output Power/Drive Current Characteristics . . . . . . . . . . . . . . . . 3–14
3.2.2.1 General Output Power and L-I Curve Measurement
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Considerations . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . 3–14
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3.2.2.2
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Laser Threshold Current . . . . . . . . . . . . . . . .
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. . . . . . . . 3–16
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3.2.2.3
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Laser Threshold Current Temperature Sensitivity . .
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. . . . . . . . 3–16
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3.2.2.4
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Output Power Levels at Particular Current Levels . .
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. . . . . . . . 3–17
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3.2.2.4.1
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Laser Output Power at the Threshold Current .
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. . . . . . . . 3–17
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3.2.2.4.2
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LED Output Power . . . . . . . . . . . . . . . .
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. . . . . . . . 3–17
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3.2.2.5
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Linearity of the Laser L-I Curve . . . . . . . . . . . .
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. . . . . . . . 3–17
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3.2.2.5.1
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Overall Linearity . . . . . . . . . . . . . . . . .
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. . . . . . . . 3–18
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3.2.2.5.2 Kinks . . . . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . 3–18
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3.2.2.5.3
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Saturation . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . 3–19
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3.2.2.6
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Laser Slope Efficiency . . . . . . . . . . . . . . . . .
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. . . . . . . . 3–19
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3.2.2.7
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Relative Intensity Noise . . . . . . . . . . . . . . . .
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. . . . . . . . 3–20
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3.2.2.8
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EELED Superluminescence . . . . . . . . . . . . . .
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. . . . . . . . 3–20
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3.2.2.9 EELED Lasing Threshold . . . . . . . . . . . . . . . . . . . . . . . . 3–20
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3.2.3
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Laser Voltage-Current Curve . . . . . . . . . . . . . . . . . . . . . . . . . 3–20
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3.2.4
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Modulated Output Characteristics . . . . . . . . . . . . . . . . . . . . . . 3–21
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3.2.4.1
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Modulated Signal Shape
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. . . . . . . . . . . . . . . . . . . . . . . . 3–21
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3.2.4.1.1 Eye Pattern
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–21
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3.2.4.1.2 Rise and Fall Times . . . . . . . . . . . . . . . . . . . . . . . . 3–23
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3.2.4.2
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Extinction Ratio and Modulation Depth . . . . . . . . . . . . . . . 3–24
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3.2.4.3 Turn-On Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–25
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3.2.4.4
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Cutoff Frequency
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–25
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3.2.5
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Tunable Laser Characteristics
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. . . . . . . . . . . . . . . . . . . . . . . . 3–26
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3.2.6
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Optical Output Fields and Component Alignment . . . . . . . . . . . . . 3–26
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3.2.6.1
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Far-Field Pattern
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–26
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3.2.6.2 Coupling Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–27
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3.2.6.3
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Front-To-Rear Tracking Ratio Deviation . .
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. . . . . . . . . . . . . 3–27
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3.2.6.4
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Front-To-Rear Tracking Error . . . . . . . .
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. . . . . . . . . . . . . 3–28
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3.2.6.5
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Polarization Extinction Ratio . . . . . . . .
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. . . . . . . . . . . . . 3–28
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3.2.7 Modulator Optical and Electrical Characteristics
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. . . . . . . . . . . . . 3–29
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3.2.7.1
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EA Modulator Characterization
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. . . . . . . . . . . . . . . . . . . . 3–29
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3.2.7.2 External Modulator Characterization . . . . . . . . . . . . . . . . . 3–30
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3.2.8 Photodetector Characteristics
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. . . . . . . . . . . . . . . . . . . . . . . . 3–31
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3.2.8.1
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Efficiency . . . . . . . . . . . . . . . . . . .
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. . . . . . . . . . . . . 3–31
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3.2.8.2
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Spatial Homogeneity . . . . . . . . . . . . .
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. . . . . . . . . . . . . 3–32
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3.2.8.3
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Linearity . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . . . . . . 3–33
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3.2.8.4 Monitor Photodetector Photocurrent . . . . . . . . . . . . . . . . . 3–34
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3.2.8.5 Dark Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–34
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3.2.8.6
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Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–35
|
|
3.2.8.7
|
Cutoff Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–35
|
|
3.2.8.8 Breakdown Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–35
|
|
3.2.8.9
|
Excess Noise Factor
|
. . . . . . . . . . . . . . . . . . . . . . . . . . 3–35
|
|
3.2.9 Receiver Characteristics
|
. . . . . . . . . . . . . . . . . . . . . . . . . . . 3–36
|
|
3.2.9.1
|
Received Optical Power Levels
|
. . . . . . . . . . . . . . . . . . . . 3–36
|
|
3.2.9.2
|
Tolerance to Incoming Signal Degradations
|
. . . . . . . . . . . . . 3–37
|
|
3.2.10 Physical Characteristics of Devices
|
. . . . . . . . . . . . . . . . . . . . 3–37
|
|
3.2.10.1 Internal Moisture and Hermeticity . . . . . . . . . . . . . . . . . . 3–37
|
|
3.2.10.1.1 Internal Moisture
|
. . . . . . . . . . . . . . . . . . . . . . . . 3–38
|
|
|
|
|
|
|
|
3.2.10.1.2 Hermeticity . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–38
3.2.10.2 ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–39
|
3.2.10.2.1
|
ESD Threshold Testing of Modules . . . . . . . . . . . . . . 3–39
|
|
3.2.10.2.2
|
ESD Susceptibility Testing of Integrated Modules . . . . . . 3–40
|
|
3.2.10.3 Flammability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–40
|
|
3.2.10.4 Die Shear Strength . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–41
|
|
3.2.10.5
|
Solderability . . . .
|
. . . . . . . . . . . . . . . . . . . . . . . . . . 3–41
|
|
3.2.10.6
|
Wire Bond Strength
|
. . . . . . . . . . . . . . . . . . . . . . . . . . 3–41
|
|
3.3 Stress Test Procedures . . . . .
|
. . . . . . . . . . . . . . . . . . . . . . . . . . 3–42
|
|
3.3.1 Mechanical Integrity Tests
|
. . . . . . . . . . . . . . . . . . . . . . . . . . 3–42
|
|
3.3.1.1
|
Mechanical Shock and Vibration Tests . . . . . . . . . . . . . . . . 3–42
|
|
3.3.1.1.1
|
Mechanical Shock . . . . . . . . . . . . . . . . . . . . . . . . 3–42
|
|
3.3.1.1.2 Vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–43
|
|
3.3.1.2
|
Thermal Shock
|
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–43
|
|
3.3.1.3
|
Fiber Integrity Tests
|
. . . . . . . . . . . . . . . . . . . . . . . . . . 3–44
|
|
3.3.1.3.1
|
Twist Test . . .
|
. . . . . . . . . . . . . . . . . . . . . . . . . . 3–45
|
|
3.3.1.3.2
|
Side Pull Test . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–45
|
|
3.3.1.3.3 Cable Retention Test . . . . . . . . . . . . . . . . . . . . . . . 3–45
|
|
3.3.1.4
|
Connectorized and Receptacle Device Durability Tests . . . . . . . 3–46
|
|
3.3.1.4.1
|
Mating Durability Test . . . . . . . . . . . . . . . . . . . . . . 3–46
|
|
3.3.1.4.2
|
Wiggle Test
|
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–46
|
|
3.3.1.4.3
|
Pull Test . . . .
|
. . . . . . . . . . . . . . . . . . . . . . . . . . 3–47
|
|
3.3.2 Non-Powered Environmental Stress Tests
|
. . . . . . . . . . . . . . . . . 3–47
|
|
3.3.2.1
|
Storage Tests . . . . . . . . . . . . .
|
. . . . . . . . . . . . . . . . . 3–47
|
|
|
|
|
|
|
|
|
3.3.2.2
|
Temperature Cycling . . . . . .
|
. . . . . . . . . . . . . . . . . . . . 3–48
|
|
3.3.2.3
|
Damp Heat Tests . . . . . . . .
|
. . . . . . . . . . . . . . . . . . . . 3–48
|
|
3.3.3
|
Powered Environmental Stress Tests
|
. . . . . . . . . . . . . . . . . . . . 3–49
|
|
3.3.3.1 High-Temperature Operations . . . . . . . . . . . . . . . . . . . . . 3–49
|
|
|
3.3.3.1.1 Test Time and Temperature Considerations . . . . . . . . . . 3–50
|
|
|
3.3.3.1.2 Other Test Condition Considerations . . . . . . . . . . . . . . 3–51
|
|
|
3.3.3.1.3 Applicability of the High-Temperature Operations Test . . . 3–52
|
|
3.3.3.2
|
Cyclic Moisture Resistance . . . . . . . . . . . . . . . . . . . . . . 3–53
|
|
3.3.3.3 Damp Heat (Powered Tests for Non-Hermetic Devices) . . . . . . 3–54
|
|
3.4 Accelerated Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–54
|
|
3.4.1
|
High-Temperature Accelerated Aging . . . . . . . . . . . . . . . . . . . . 3–55
|
|
3.4.1.1
|
Testing at Constant Temperature . . . . . . . . . . . . . . . . . . . 3–55
|
|
3.4.1.2
|
Alternative (Variable Temperature) Tests
|
. . . . . . . . . . . . . . 3–56
|
|
3.4.1.3
|
Additional Considerations for Lasers . . .
|
. . . . . . . . . . . . . . 3–56
|
|
3.4.1.4
|
Additional Considerations for Photodiodes
|
. . . . . . . . . . . . . 3–57
|
|
3.4.1.5
|
Additional Considerations for External Modulators . . . . . . . . . 3–57
|
|
3.4.2
|
Temperature Cycling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–57
|
|
3.4.3
|
Damp Heat for Non-Hermetic Modules . . . . . . . . . . . . . . . . . . . 3–57
|
|
3.4.4
|
Failure Rates and Reliability Calculations . . . . . . . . . . . . . . . . . 3–58
|
|
3.4.4.1
|
Failure Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–58
|
|
|
|
|
|
|
3.4.4.2 Analysis of Gradual Degradations . . . . . . . . . . . . . . . . . . . 3–58
|
3.4.4.3
|
Reliability Calculations . . . . .
|
. . .
|
. . . . . . . . . . . .
|
. . .
|
.
|
. 3–60
|
|
3.4.4.4
|
Reporting of Results . . . . . .
|
. . .
|
. . . . . . . . . . . .
|
. . .
|
.
|
. 3–60
|
4 Qualification of Optoelectronic Devices
4.1 Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
4.1.1 Characterization Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
4.1.2 Characterization Test Pass/Fail Criteria . . . . . . . . . . . . . . . . . . . 4–9
4.2 Stress Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9
4.2.1 Mechanical Integrity and Environmental Stress Tests . . . . . . . . . . . 4–9
4.2.2 Stress Test Pass/Fail Determination . . . . . . . . . . . . . . . . . . . . . 4–15
4.3 Considerations for the Qualification of Pump Laser Modules . . . . . . . . . . 4–16
4.4 Considerations for the Qualification of Integrated Modules . . . . . . . . . . . 4–17
4.4.1 Sample Size and Level of Assembly Considerations . . . . . . . . . . . . 4–17
4.4.2 Operational Shock and Vibration Tests . . . . . . . . . . . . . . . . . . . 4–18
-
Optoelectronic Device Reliability Testing
5.1 Accelerated Aging Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
5.2 Accelerated Aging End-of-Life Thresholds and Failures . . . . . . . . . . . . . 5–4
-
Lot-To-Lot Controls for Optoelectronic Devices
6.1 Visual Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.2 Electrical and Optical Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.3 Screening . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.3.1 Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.3.2 Screening Pass/Fail Criteria . . . . . . . . . . . . . . . . . . . . . . . . . 6–2
-
Qualification and Lot-to-Lot Controls for Other Component Parts
7.1 Thermoelectric Coolers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
|
|
7.1.1
|
TEC-Specific Test Information . . . . . . . . . . . . . . . . . . . . . . . .
|
7–2
|
|
|
7.1.1.1 Thermoelectric Cooler and Temperature Sensor Checks . . . . . .
|
7–2
|
|
|
7.1.1.2 Power Cycle Test . . . . . . . . . . . . . . . . . . . . . . . . . . . .
|
7–2
|
|
|
7.1.2
|
TEC Qualification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
|
7–2
|
|
|
7.1.3
|
TEC Lot-to-Lot Controls . . . . . . . . . . . . . . . . . . . . . . . . . . .
|
7–4
|
|
7.2
|
Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
|
7–4
|
|
7.3
|
Optical Isolators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
|
7–4
|
|
7.4
|
Fiber Pigtails and Optical Connectors . . . . . . . . . . . . . . . . . . . . . . .
|
7–4
|
|
7.5
|
General Electrical/Electronic Components . . . . . . . . . . . . . . . . . . . .
|
7–5
|
|
7.6
|
Hybrids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
|
7–5
|
